Design
FPGA Design
Embedded Firmware Design

Manufacturing
IC Frontend Fabrication
CMOS and III-V wafer processing
Supplying of silicon, III-V and Other Specialty Substrates
IC Backend Fabrication
Backgrinding
Wafer Sawing and Dicing by Diamond Saw or Laser Beam
Wirebonding
Solder Ball or Gold Stud Bumping
Flip-Chip (FC) Bonding
Micro-riveting of IC Die on Flexible PCB
BGA Solder Ball Rework
Bond Wire Rework
IC Packaging
Circuit-on-Board (COB) Fabrication and Assembly
PCB Fabrication
PCB Design and Assembly
PCB Reflow Profile Optimization
Flexible and Plastic PCB Fabrication

Failure Analysis
Non-Destructive Analysis
Scanning Acoustic Tomography (SAM/C-SAM)
3D Optical Microscopy (for BGA solder ball joint inspection)
2D X-ray
3D X-ray Computed Tomography (CT)
Defect Localization
Optical Beam Induced Resistance Change (OBIRCH)
Photon Emission Microscopy (InGaAs PEM/EMMI for weak signal detection)
Scanning Electron Microscope (SEM) Voltage Contrast
Electrical Measurement
Time Domain Reflectometry (TDR) Measurement
Scanning Electron Microscope (SEM) Nano Probing
Atomic Force Probing (AFP)
On-wafer DC, AC and RF testing
Physical Failure Analysis
Focus Ion Beam (FIB) Cross-Section Analysis
FIB Circuit Edit
Scanning Electron Microscopy (SEM)
Transmission Electron Microscopy (TEM)
Reverse Engineering
IC and PCB Circuit/Layout/Process/Technology Identification and Extraction
Patent infringement Analysis
Pin Mapping
Cost Analysis
Sample Preparation
IC Decapsulation
IC Delayering
Focus Ion Beam (FIB) Cross-Section Polishing
IC Backside Polishing

Material Analysis
Element Identification
Energy-Dispersive X-ray Spectroscopy (EDS)
Wavelength-Dispersive X-ray Spectroscopy (WDS)
Composition Analysis
Secondary Ion Mass Spectroscopy (SIMS)
X-Ray Photoelectron Spectroscopy / Electron Spectroscopy for Chemical Analysis (XPS / ESCA)
Chemical Bond Analysis
Auger Electron Spectroscopy (AES)
Fourier Transform Infrared Spectroscopy (FTIR)
Crystal Analysis
Transmission Electron Microscopy (TEM) Diffraction Imaging
Surface Analysis
Conductive Atomic Force Microscopy (C-AFM)

Reliability Analysis
Electrostatic Discharge (ESD) and Latchup Test
Component-Level ESD Testing (HBM/MM/CDM)
Latchup Testing
Wafer-Level ESD Testing (TLP, VFTLP)
System-Level ESD Testing (IEC 61000-4-2)
ESD Material Testing
ESD Design Consultancy
Mechanical Test
Shock Test
Drop Test
Vibration Test
Cyclic/Monotonic Bending Test
Strain Gauge Test
Acceleration/SRS Analysis
Solderability Test
Pad Cratering Test
Thermal Mechanical Analysis (TMA) (for glass transition temperature, coefficient of thermal expansion and soft point extraction)
Environment Test
Temperature Cycling Test (TCT)
Thermal Shock Test (TST)
Pressure Cooker Test (PCT)
Temperature and Humidity Bias Test (THB)
Highly Accelerated Stress Test (HAST)
Irradiation Testing (for soft error and single event upset analysis)
Storage Test
High Temperature Storage Test (HTS)
Low Temperature Storage Test (LTS)
Temperature & Humidity Test (THS)
High Fault Coverage Life Test
Salt Spray Test (SALT)
Operating Life Test
High Temperature Operating Life Test (HTOL)
Low Temperature Operating Life Test (LTOL)
Test Board Design and Fabrication

LED Testing
Light Characterization
Integrating Sphere
Thermal Analysis
Extraction of Thermal Resistance (?th) and Junction Temperature (Tj)
Lifetime Analysis
IESNA LM-80 by Energy Star

Consultancy and Training Services
Failure and Material Analysis
Quality and Reliability Engineering
ESD and LU Design, Testing and FA
RF Testing
IC Design
Embedded Firmware Design

Hardware Tools and Testers
ESD and LU Testers
Temperature Control Systems